Naʻe taki ʻe he lanu ʻe ua tupu ʻa e maama ʻo e laʻi pepa feliliuaki

1.Zero light spot, uniform light
2.Flip chips:CSP encapsulation technology without wire bonding
3.Flip chips has bigger pole for high current & work more stable
4.Ta:-25~40℃；Tc：75℃（max）
5. 3M adhesive backing simplifies mounting
6. 24VDC available for longer max run and human safety.
7.Up to 640 chips per meter , Double color in 2700K+6500K
8. Less heat generation
9. 3 years warranty